Packing：1 pc per polybag and inner box 36 pcs per strong seaworthy export carton.

r 20,000 garment in CIF terms (USD 9/pc CIF HAMBURG per garment). The total freight:8,000 Dollaers,premiums:2,000 Dollars.So the exchange rate appreciation is ().

A、70%

B、60%

C、55%

D、50%

听力原文： By Paul Abrahams in Tokyo

Results from Japan's largest petrochemicals companies for the year to March 31st reflect the crisis facing a sector plagued by sluggish domestic demand, over capacity, plunging prices and the appreciation of the yen.

News of the sector's dire trading position follow this week's decision by Showa Denko to sell its poly styrene business.

The company, a marginal manufacturer, sold its 30,000 tonnes a year Kawasaki Plant to Asahi Chemical, Japan's largest polystyrene manufacturer with capacity of about 333,000 tonnes a year, equivalent to about 25 per cent of the market. The move was the latest in a series of alliances and mergers as the troubled industry restructures.

Mitsubishi Petrochemical, the country's biggest plastics group, reported a loss of Y 8.39 bn ($80m) compared with pre-tax profits last year of Y 8.25 bn. The group made an operating loss of Y 13.8 bn, the first since 1982. The poor result came despite cost cutting measures, lower raw material prices, and Y 4 bn worth of profits from equity sales.

Turnover fell 12.2 per cent from Y 372 bn to Y 326 bn, as prices and volumes declined. Earnings per share, which reached Y 52.5 in 1991, fell to a loss per share of Y 9.44. The group, which is scheduled to merge with Mitsubishi Kasei on October 1st, cut its dividend from Y 8 per share to Y 4.

Mitsubishi Kasei's pre-tax profits fell 76. 8 per cent from Y 9.3 bn last year to Y 2.2 bn. The group reported its first operating loss in 40 years at Y 467 m, and only managed to post positive pre-tax results by selling Y15.7 bn worth of equities. Turnover fell 1.8 per cent, the fourth yearly decline, to Y696 bn. The dividend was halved to Y 3 per share.

Mr. Morihisa Takano, managing director, said the newly merged group would generate pre-tax profits of Y 10 bn on sales of Y 55 bn during the year to March 1995.

He predicted petrochemicals prices would bottom out during the summer. No decision had been made a bout the dividend, but the new company could pass it during the current year, the pre-tax profits at Mitsui Petrochemical Industries, Japan's biggest polyethylene maker, plunged 75 per cent from Y 9 bn to Y 2.26bn on sales down 9.3 per cent at Y 272 bn. The company blamed poor demand for the slump which offset the benefits of cost-cutting measures. The dividend is unchanged at Y 6 per share. The group forecasts pre-tax profits for the current year marginally up at Y 3 bn on turnover of Y 276 bn.

Shin-Etsu, one of Japan's biggest makers of poly vinyl chloride, reported profits down 26.1 per cent from Y 17.6 bn to Y 13 bn. Sales increased 0.2 per cent from Y 275 bn to Y 276 bn. Net profits fell 26.6 per cent to Y 7.08 bn, or Y 21.85 per share.

The group maintained the final dividend at Y3.75, making the full-year pay out Y7.5 per share. Shin-Etsu forecasts pre-tax profits for the cur rent year of Y 15.5 bn on sales of Y 277 bn.

The outlook for the petrochemicals industry remains bleak. The imbalance between supply and demand for ethylene, the basic building block of petrochemicals, is about 2.8m tonnes of ethylene and is set to deteriorate further this year.

A massive 700,000-tonne-a-year ethylene complex owned by Maruzen, Mitsui Petrochemical and Sumitomo Chemical comes on stream later this year and Mitsubishi Petrochemical is also commissioning a new 300,000-tonne-a-year plant this year.

？You will hear a report presented by a journalist from Tokyo. He talks about the difficult situations met by Japanese chemical groups. He gives some important figures of four biggest chemical groups in Japan.

？For each question 23-30 mark one letter (A, B or C) for the correct answer

？After you have listened once, replay he recording.

The crisis met by Japanese chemical groups is caused by

A．over capacity

B．high prices

C．high cost

A．是

B．否

A、CPI - Cycles per Instruction，每条指令的时钟周期数。

B、PC - Programe Counter,程序计数器

C、ACC - Accumulator, 累加器，运算器中一个重要的寄存器

D、IR - Instruction Register, 指令寄存器

听力原文： By Paul Abrahams in Tokyo

Results from Japan's largest petrochemicals companies for the year to March 31st reflect the crisis facing a sector plagued by sluggish domestic demand, over capacity, plunging prices and the appreciation of the yen.

News of the sector's dire trading position follow this week's decision by Showa Denko to sell its poly styrene business.

The company, a marginal manufacturer, sold its 30,000 tones a year Kawasaki Plant to Asahi Chemical, Japan's largest polystyrene manufacturer with capacity of about 333,000 tones a year, equivalent to about 25 per cent of the market. The move was the latest in a series of alliances and mergers as the troubled industry restructures.

Mitsubishi Petrochemical, the country's biggest plastics group, reported a loss of Y 8.39 bn ($80m) compared with pre-tax profits last year of Y 8.25 bn. The group made an operating loss of Y 13.8 bn, the first since 1982. The poor result came despite cost cutting measures, lower raw material prices, and Y 4 bn worth of profits from equity sales.

Turnover fell 12.2 per cent from Y 372 bn to Y 326 bn, as prices and volumes declined. Earnings per share, which reached Y 52.5 in 1991, fell to a loss per share of Y 9.44. The group, which is scheduled to merge with Mitsubishi Kasei on October 1st, cut its dividend from Y 8 per share to Y 4.

Mitsubishi Kasei's pre-tax profits fell 76. 8 per cent from Y 9.3 bn last year to Y 2.2 bn. The group reported its first operating loss in 40 years at Y 467 m, and only managed to post positive pre-tax results by selling Y15.7 bn worth of equities. Turnover fell 1.8 per cent, the fourth yearly decline, to Y696 bn. The dividend was halved to Y 3 per share.

Mr. Morihisa Takano, managing director, said the newly merged group would generate pre-tax profits of Y 10 bn on sales of Y 55 bn during the year to March 1995.

He predicted petrochemicals prices would bottom out during the summer. No decision had been made a bout the dividend, but the new company could pass it during the current year, the pre-tax profits at Mitsui Petrochemical Industries, Japan's biggest polyethylene maker, plunged 75 per cent from Y 9 bn to Y 2.26bn on sales down 9.3 per cent at Y 272 bn. The company blamed poor demand for the slump which offset the benefits of cost-cutting measures. The dividend is unchanged at Y 6 per share. The group forecasts pre-tax profits for the current year marginally up at Y 3 bn on turnover of Y 276 bn.

Shin-Etsu, one of Japan's biggest makers of poly vinyl chloride, reported profits down 26.1 per cent from Y 17.6 bn to Y 13 bn. Sales increased 0.2 per cent from Y 275 bn to Y 276 bn. Net profits fell 26.6 per cent to Y 7.08 bn, or Y 21.85 per share.

The group maintained the final dividend at Y3.75, making the full-year pay out Y7.5 per share. Shin-Etsu forecasts pre-tax profits for the cur rent year of Y 15.5 bn on sales of Y 277 bn.

The outlook for the petrochemicals industry remains bleak. The imbalance between supply and demand for ethylene, the basic building block of petrochemicals, is about 2.8m tones of ethylene and is set to deteriorate further this year.

A massive 700,000-tonne-a-year ethylene complex owned by Maruzen, Mitsui Petrochemical and Sumitomo Chemical comes on stream later this year and Mitsubishi Petrochemical is also commissioning a new 300,000-tonne-a-year plant this year.

—You will hear a report presented by a journalist from Tokyo. He talks about the difficult situations met by Japanese chemical groups. He gives some important figures of four biggest chemical groups in Japan.

—For each question 23-30 mark one letter (A, B or C) for the correct answer

—After you have listened once, replay he recording.

The crisis met by Japanese chemical groups is caused by

A．over capacity

B．high prices

C．high cost

1000 PCS,成交价格CFR QUEBEC USD6.50/PC , TJTS516 型号的拉杆箱1200PCS,成交价格CFR QUEBEC USD5.80/PC, Packing :2PCS PER CARTON,N/M,Payment:L/C at Sight, Shipment :On Or Before the end of August,no partial-shipment。 请问该合同项下货物是否允许分批装运？

A．是

B．否

A．是

B．否

阅读以下说明和程序流程图，将应填入(n)处的字句写在对应栏内。

[说明]

当一元多项式中有许多系数为零时，可用一个单链表来存储，每个节点存储一个非零项的指受和对应系数。

为了便于进行运算，用带头节点的单链表存储，头节点中存储多项式中的非零项数，且各节点按指数递减顺序存储。例如：多项式8x5-2x2+7的存储结构为：

流程图图3-1用于将pC(Node结构体指针)节点按指数降序插入到多项式C(多项式POLY指针)中。

流程图中使用的符号说明如下：

(1)数据结构定义如下：

define EPSI 1e-6

struct Node{ /*多项式中的一项*/

double c； /*系数*/

int e； /*指数*/

Struct Node *next；

}；

typedef struct{ /*多项式头节点*/

int n； /*多项式不为零的项数*/

struct Node *head；

}POLY；

(2)Del(POLY *C，struct Node *p)函数，若p是空指针则删除头节点，否则删除p节点的后继。

(3)fabs(double c)函数返回实数C的绝对值。

[图3-1]

(1)

(2) 3D Heterogeneous Integration Every logic generation needs to add new functions in each node to keep unit price constant (to preserve margins). This is getting more difficult due to the following challenges: • Little functions left on board/system to co-integrate • Heterogeneous cores specialized per function—specialized performance improvement requirements needed per each dedicated core • Off-package memories—costly to co-integrate with logic, technology not fitting to baseline CMOS (where wafer/die-level stacking might be needed) Die cost reduction has been enabled so far by concurrent scaling of poly pitch, metal pitch, and cell height scaling. This would like to continue until 2024. Cell height scaling would likely to be pursued by 3D device (e.g., finFET and lateral GAA), device stacking, 3DVLSI, and design-technology-co-optimization (DTCO) constructs in cell and physical design. However, this scaling route will become challenged by diminishing electrical/system benefits and also by diminishing areareduction/$ at SoC level. Therefore, it is necessary to pursue 3D integration routes such as device-over-device stacking and/or monolithic 3D (or sequential integration) These pursuits will maintain system performance and power gains while maintaining the cost advantages such as treating expensive non-scaled components somewhere else and using the best technology fit per tier functionality. 3DVLSI offers the possibility to stack devices enabling high-density contacts at the device level (up to 100 million vias per mm² with N14 ground rules). 3DVLSI can be routed either at gate or transistor levels. The partitioning at the gate level allows IC performance gain due to wire length reduction while partitioning at the transistor level by stacking nFET over pFET (or the opposite), enabling the independent optimization of both types of transistors (customized implementation of channel material/substrate orientation/channel and raised source/drain strain, etc.) while enabling reduced process complexity compared to a planar co-integration, for instance the stacking of III-V nFETs above SiGe pFETs. These high mobility transistors are well suited for 3DVLSI because their process temperatures are intrinsically low. 3DVLSI, with its high contact density, can also enable applications requiring heterogeneous co-integration with high-density 3D vias, such as NEMS with CMOS for gas sensing or highly miniaturized imagers. In order to address the transition from 2D to 3DVLSI, the following generations are projected in the IRDS roadmap: • Die-to-wafer and wafer-to-wafer stacking o Approach: Fine-pitch di-electric/hybrid bonding and/or flip-chip assembly o Opportunities: Reducing bill-of-materials on the system, heterogenous integration o Challenges: Design/architecture partitioning • N&P stacking o Approach: Sequential integration o Opportunities: Reducing 2D footprint of standard cell o Challenges: Minimizing interconnect overhead is key between N&P enabling low-cost • Adding logic 3D SRAM and/or MRAM stack (embedded/stacked) o Approach: Sequential integration and/or wafer transfer o Opportunities: 2D area gain, better connection between logic and memory enabling system latency gains. o Challenges: Solving the thermal budget of interconnect at the lower tier if stacking approach is used, Revisiting the cache hierarchy and application requirements, power, and clock distribution • Adding Analog and I/O o Approach: Sequential integration and/or wafer transfer o Opportunities: Giving more freedom to designer and allows integration of high-mobility channels, pushing non-scaling components to another tier, IP re-use, scalability, IO voltage enablement in advanced nodes o Challenges: Thermal budget, reliability requirements, power and clock distribution • True-3D VLSI: Clustered functional stacks, beyond CMOS adoption o Approach: Sequential integration and/or wafer transfer o Opportunities: Complementary functions other than CMOS replacement such as neuromorphic, highbandwidth memory. Application examples include image recognition in neuromorphic fabric and wideIO sensor interfacing (e.g., DNA sequencing, molecular analysis). o Challenges: Architecting the application where low energy at low frequency and highly-parallel interfaces could be utilized, mapping applications to non-Von Neumann architectures. 1) Which of the following may not be the challenge to add new functions in each node of logic generation？ () A Little functions left on board/system to co-integrate B Heterogeneous cores specialized per function—specialized performance improvement requirements needed per each dedicated core C Technology not fitting to baseline CMOS D SRAM and FLASH memories 2) Which of the following may not reduce the die cost？ () A Scaling of pecialized performance B Scaling of poly pitch C Scaling of metal pitch D Scaling cell height 3) Cell height scaling would likely to be pursued by () A 3D device B Device stacking C 3DVLSI D all of the above 4) 3D integration routes may not include () A device-over-device stacking B scaling of poly pitch C sequential integration D monolithic 3D 5) We can maintain the cost advantages by () for 3D integration. A using new materials for channel B using high κ dielectrics for gate C treating expensive non-scaled components somewhere else D Moore’s Law 6) According to the author, which of the following is false？ () A 3DVLSI may achieve high-density contacts at the device level. B 3DVLSI can be routed either at gate or transistor levels. C 3DVLSI allows IC performance gain due to wire length reduction D 3DVLSI may enable the optimization of one type of transistors. 7) What is the challenge for monolithic 3D integration？ () A Design of the system B Architecture C Minimizing interconnect overhead D Applications requiring heterogeneous co-integration with high-density 3D vias 8) What is the advantage of the N&P stacking？ A Reducing bill-of-materials on the system B Reducing 2D footprint of standard cell C Reducing the thermal budget of interconnect D All of the above 9) According to the author, which of the following can achieve the 2D area gain？ () A Logic 3D SRAM and/or MRAM stack B Scaling of poly pitch C Scaling of metal pitch D All of the above 10) The author implies that neuromorphic may () A be realized by wafer transfer. B be realized by CMOS solution. C be used in Von Neumann architectures. D be a highbandwidth memory.

Dear Sir/ Madam, Referring to the fax exchanged between us recently, we confirm the following order placed with you: Name of commodity: IBM personal Computers, CPU 80686. Quantity: 300 sets Price: US $ 700.00 per set CIF Guangzhou, China Packing: Each set is to be wrapped in a poly bag and packed in a standard carton lined with foam (用塑料泡沫铺垫) Shipment: Within 45 days after receipt of the relevant L/C. We are fully confident that you will pay special attention to the packing of the goods in case they should be damaged in transit. After receiving your sales confirmation, we will establish the L/C. Meanwhile, please note that shipment must be effected within the validity of our L/C. If the shipment comes up to our expectation, substantial orders will follow. There is a great demand for your products here, so prompt delivery will be highly appreciated. Yours faithfully, 要求： 根据我方情况，写一封接受订单的回复函。 我方是一家美国计算机出口商。之前，一家中国进口商和我方经过反复谈判，终于与5月6日写来上述订购信，同意向我方订购300台计算机。 我方接受对方的订购，随函寄送销售确认书。我方承诺将特别注意货物包装使之能够承受运输过程中的粗暴搬运（rough handling in transit）。提醒对方及时开立信用证，承诺一收到信用证后马上安排并如期装运，请对方尽管放心。 回复函结构： 1） 感谢订购； 2） 接受订单，随寄销售确认书，承诺将注意包装； 3） 要求开立信用证，承诺如期装运； 4） 期望收到信用证。